Contract Mechanical Engineering & Electronics Packaging
Specializing in custom sheet metal chassis, thermal path management, and ECAD/MCAD integration for electronics enclosures. Leveraging backgrounds in high-reliability aerospace environments to deliver DFM-ready manufacturing packages built for zero-revision production runs.
Precision chassis design, bend reliefs, notch clearances, and PEM hardware schedules (S-nuts, standoffs, studs) optimized for standard shop tooling.
Seamless translation of complex PCB STEP exports into mechanical envelopes, managing component keep-outs, connector alignment, and board mounting.
Conduction heat spreading, thermal interface pad (TIM) compression sizing, and custom extruded/milled heatsink integration for tight envelopes.
Production-ready 2D drawing packages utilizing ASME Y14.5 GD&T, standard finish callouts (MIL-DTL-5541 / MIL-A-8625), and flat patterns.
5052-H32 Aluminum sheet metal with internal PEM hardware layout and passive heatsink interface.
Chem-film clear aluminum enclosure with silicone perimeter gasket seal and PCB thermal paths.